Dell PowerEdge R710 manual

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  • Brand: Dell
  • Product: Server
  • Model/name: PowerEdge R710
  • Filetype: PDF
  • Available languages: English

Table of Contents

Page: 0
Dell™
POWEREDGE™
R710
technical guidebook
Inside the poweredge R710
Page: 1
Dell™ PowerEdge™ R710 Technical Guidebook
Section 1. system overview	 6
A. Overview / Description	 6
B. Product Features Summary	 6
Section 2. Mechanical	 7
A. Chassis Description	 7
B. Dimensions and Weight	 8
C. Front Panel View and Features	 8
D. Back Panel View and Features	 8
E. Power Supply Indicators	 9
F. NIC Indicators	 9
G. Side Views and Features	 9
H. Rails and Cable Management	 10
I. Fans	 10
J. Control Panel / LCD	 11
K. Security	 11
	 I. Cover Latch	 11
	 II. Bezel	 12
	 III. Hard Drive	 12
	 IV. TPM	 12
	 V. Power Off Security	 12
	 VI. Intrusion Alert	 12
	 VII. Secure Mode	 12
L. USB Key	 12
M. Battery	 12
N. Field Replaceable Units (FRU)	 12
Section 3. Electrical	 13
A. Volatility	 13
B. ePPID (Electronic Piece Part Identification)	 13
Section 4. Power, Thermal, Acoustic	 14
A. Power Efficiencies	 14
B. Power Supplies	 14
	 I. Main Power Supply	 14
C. Power Supply Specifications	 15
D. Environmental Specifications	 16
E. Power Consumption Testing	 17
F. Maximum Input Amps	 17
G. Energy SMART Enablement	 17
H. Acoustics	 18
TABLE OF CONTENTS
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Dell™ PowerEdge™ R710 Technical Guidebook
Section 5. Block Diagram	 19
Section 6. Processors	 21
A. Overview / Description	 21
B. Features	 21
C. Supported Processors	 21
D. Processor Configurations	 22
Section 7. Memory	 23
A. Overview / Description	 23
B. DIMMs Supported	 23
C. Speed	 24
D. Slots / Risers	 27
E. Supported Configurations	 27
F. Mirroring	 28
G. Advanced ECC (Lockstep) Modes	 28
H. Optimizer (Independent Channel) Mode	 28
Section 8. Chipset	 29
A. Overview / Description	 29
Section 9. BIOS	 31
A. Overview / Description	 31
B. Supported ACPI States	 31
C. I C (Inter-Integrated Circuit)	 32
Section 10. Embedded NICs / LAN on Motherboard (LOM)	 32
A. Overview / Description	 32
Section 11. I/O Slots	 33
A. Overview / Description	 33
B. PCI Express Risers	 35
C. Additional Riser Restrictions	 35
D. X16 Express Card Specifications	 35
E. Boot Order	 35
Section 12. Storage	 36
A. Overview / Description	 36
B. Drives	 36
	 I. Internal Hard Disk drives	 36
	 II. Hard Disk Drive Carriers	 37
	 III. Empty Drive Bays	 37
	 IV. Diskless Configuration Support	 38
	 V. Hard Drive LED Indicators	 38
C. RAID Configurations	 38
2
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Dell™ PowerEdge™ R710 Technical Guidebook
D. Storage Controllers	 39
	 I. SAS 6/iR	 39
	 II. PERC 6i	 40
E. LED Indicators	 41
F. Optical Drives	 41
G. Tape Drives	 41
Section 13. Video	 42
A. Overview / Description	 42
Section 14. Audio	 43
A. Overview / Description	 43
Section 15. Rack Information	 43
A. Overview / Description	 43
B. Cable Management Arm (CMA) 	 43
C. Rails	 44
Section 16. Operating Systems	 45
A. Overview / Description	 45
Section 17. Virtualization	 47
A. Overview / Description	 47
Section 18. Systems Management	 47
A. Overview / Description	 47
B. Server Management	 47
C. Embedded Server Management	 48
	 I. Unmanaged Persistent Storage	 48
	 II. Lifecycle Controller/Unified Server Configurator	 48
	 III. iDRAC6 Express	 49
	 IV. iDRAC6 Enterprise	 49
Section 19. Peripherals	 52
A. USB peripherals	 52
B. External Storage	 52
Section 20. Documentation	 53
A. Overview, Description, and List	 53
Section 21. Packaging Options	 53
appendix	 54
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Dell™ PowerEdge™ R710 Technical Guidebook
5
The Dell™ PowerEdge™ R710
The Dell PowerEdge R710 is designed to be the cornerstone of today’s competitive enterprise.
Engineered in response to input from IT professionals, it is the next-generation 2U rack server
created to efficiently address a wide range of key business applications. The successor to the
PowerEdge 2950 III, the R710 runs the Intel®
Xeon®
5500 Series Processors and helps you lower
the total cost of ownership with enhanced virtualization capabilities, improved energy efficiency,
and innovative system management tools.
Strong IT Foundation
As an IT professional, you want a data center built to allow for organic growth and the ability to scale
based on your company’s changing requirements. You need complete solutions that allow you to
focus your time and money on managing and growing your business. Dell understands your needs and
responds with an expanding portfolio of enterprise servers, storage technologies, and services with a
single goal: to help you simplify IT.
Purposeful Design
The R710 takes advantage of Dell’s system commonality. Once your IT managers learn one system, they
understand how to manage next-generation Dell servers. Logical component layout and power supply
placement also provide a straightforward installation and redeployment experience. Featuring 18 DIMM
slots and 4 integrated network connections, the R710 delivers the critical components to virtualization
and database performance. The Intel Xeon Processor 5500 Series adapts to your software in real time,
processing more tasks simultaneously. Using Intel®
Turbo Boost Technology, the R710 can increase
performance during peak usage periods. You can then help reduce operating costs and energy usage
with Intel®
Intelligent Power Technology, which proactively puts your server into lower power states when
demand decreases. Increased memory slots also save money by enabling you to use smaller,
less-expensive DIMMs to meet your computing needs.
Enhanced Virtualization
Featuring Intel Xeon-based architecture, embedded hypervisors, large memory capacity, and integrated
I/O, the next-generation Dell PowerEdge R710 delivers better overall system performance and greater
virtual machine-per-server capacity. With optional factory-integrated virtualization capabilities, you get
tailored solutions – built with the latest technologies from Dell and our trusted partners – which allow
you to streamline deployment and simplify virtual infrastructures. Choose your hypervisor from market
leaders such as VMware®
, Citrix®
, and Microsoft®
, and enable virtualization with a few mouse clicks.
Energy-Optimized Technologies
Using the latest Energy Smart technologies, the R710 reduces power consumption while increasing
performance capacity versus the previous generation servers. Enhancements include efficient power
supply units right-sized for system requirements, improved system-level design efficiency, policy-driven
power and thermal management, and highly efficient standards-based Energy Smart components. Dell's
advanced thermal control delivers optimal performance at minimal system and fan power consumption
resulting in our quietest 2U servers to date. These enhancements maximize energy efficiency across our
latest core data center servers without compromising enterprise performance.
Simplified Systems Management
Gain more control with the next-generation Dell OpenManage™ suite of management tools. These tools
provide enhanced operations and standards-based commands designed to integrate with existing
systems for effective control. Dell Management Console (DMC) helps simplify operations and creates
stability by shrinking infrastructure management to one console. This console delivers a single view and
a common data source into the entire infrastructure management. Built on Symantec®
Management
Platform, it has an easily extensible, modular foundation that can provide basic hardware management
all the way up to more advanced functions, such as asset and security management. Dell Management
Console reduces or eliminates manual processes, enabling you to save time and money for more
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Dell™ PowerEdge™ R710 Technical Guidebook
6
Section 1. System Overview
A. Overview / Description
The PowerEdge R710 will lead Dell's 11th Generation PowerEdge portfolio in key areas of differentiation,
primarily:
	 • 
Virtualization
	 • 
Power, thermal, efficiency
	 • 
Systems management, and usability
B. Product Features Summary
strategic technology usage. Secure, efficient, and more user friendly than its predecessors, the Dell
Unified Server Configurator (USC) delivers “Instant On” integrated manageability through a single
access point. You get quick, persistent access to the tool because it is embedded and integrated into
the system for increased flexibility and capabilities. The USC is a one-stop shop for deploying operating
systems with built-in driver installations, firmware updates, hardware configuration, and issue diagnoses.
Feature Details
Processor Nehalem EP
Front Side Bus Intel®
QuickPath Interconnect (QPI) @ maximum 6.GT/s
# Procs 2S
# Cores 4 cores
L2/L3 Cache 4MB and 8MB
Chipset Tylersberg
DIMMs/Speed 18 RDIMM or UDIMM DDR3 (9 per processor)
Min/Max RAM 1GB – 144GB
HD Bays
Internal hard drive bay and hot-plug backplane
Up to six 3.5" SAS or SATA drives without optional flex bay OR
Up to eight 2.5" SAS or SATA drives with optional flex bay
HD Types SAS, SATA, Near-line SAS, and SSD
Ext Drive Bay(s) Optional flex-bay expansion to support a half-height TBU
Int. HD Controller PERC 6i and SAS 6/iR
Opt. HD Controller
BIOS
Video Based on the Matrox G200 w/iDRAC
Availability
Server
Management
I/O Slots Two x8 and two x4 PCIe Gen2 slots or One x16 PCIe slot and two x4 PCIe Gen2
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Dell™ PowerEdge™ R710 Technical Guidebook
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From view 2.5" HDD Chassis (without bezel)
Feature Details
RAID PERC 6i utilizing battery backed 256MB DDRII 667
NIC/LOM Broadcom 5809C (2 cards/4ports)
USB Five (two front, two rear, one internal)
Power Supplies
Two hot-plug high-efficient 570W PSU OR
Two hot-plug 870W PSUs (1+1)
Front Control
Panel
The system control panel is located on the front of the system chassis to provide
user access to buttons, display, and I/O interfaces
System ID Front and rear (0x0235)
Fans
Five hot-swappable
Additional fan integrated into each power supply
Single processor configurations will only have four fans
Chassis 2u Rackmount
Section 2. Mechanical
A. Chassis Description
PowerEdge R710 is a 2U rackmount chassis. The updated design includes a new LCD, bezel and
hard-drive carriers. Additional changes include tool-less rack latches, a pull out tray for customer labels,
and LOM0/iDRAC MAC address; labels; support persistent storage (internal USB and SD card slots and
external SD card slots); updated power supplies and removal process.
From view 3.5" HDD Chassis (without bezel)
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Dell™ PowerEdge™ R710 Technical Guidebook
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B. Dimensions and Weight
	 Height	 8.64cm (3.40")
	 Width	 44.31cm (17.44")
	 Depth	 68.07cm (26.80")
	 Weight (maximum config) 	 26.1kg (57.54lbs)
.
C. Front Panel View and Features
Front I/O panel access including USB and VGA interfaces. The following components are located on
the front:
	 • 
Express service tag (Information tag). A slide-out panel for system identification labels
	 • 
Power on indicator, power button
	 • 
NMI indicator (Nonmaskable interrupt). A device sends an NMI to signal the processor about
hardware errors. It is used to troubleshoot software and device driver errors when using certain
operating systems
	 • 
(2) USB connectors. Connects USB devices to the system. The ports are USB 2.0 compliant
	 • 
Video connector
	 • 
LCD menu buttons. Allows you to navigate the control panel LCD menu
	 • 
LCD panel. Provides system ID, status information, and system error messages
	 • 
System identification button
	 • 
Optical drive (optional)
	 • 
Hard drives
	 • 
Flex bay
D. Back Panel View and Features
The following components are located on the rear panel of the R710 enclosure:
	 • 
(1) 15-pin VGA connector
	 • 
(1) 9-pin serial port connector
	 • 
(4) 10/100/1000 Ethernet RJ-45 connectors
	 • 
(1) Rear system ID button
	 • 
(1) Active ID Cable Management Arm external LED jack
	 • 
(2) USB ports
	 • 
(1) (Optional) iDRAC6 Enterprise RJ-45 connector
	 • 
(1) Optional) iDRAC6 Express SD module
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Dell™ PowerEdge™ R710 Technical Guidebook
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indicator indicator code
Link and activity indicators are off The NIC is not connected to the network
Link indicator is green The NIC is connected to a valid network link at 1000 Mbps
Link indicator is amber The NIC is connected to a valid network link at 1000 Mbps
Activity indicator is green blinking Network data is being sent or received
G. Side Views and Features
E. Power Supply Indicators
The PSUs on the PE R710 have one status bi-color LED: green for AC power present and amber for
a fault.
F. NIC Indicators
led Power Supply status
AC power is not present
AC power is present
Fault of any kind is detected
DC power is applied to the system
PSU mismatch (when hot-added/swapped)
Table: Power Supply Indicator
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Dell™ PowerEdge™ R710 Technical Guidebook
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I. Fans
Fans
Five hot-swappable fans are mounted in a fan gantry that is located in the chassis between the hard
drive bay and the processors. Each fan has a blind mate 2x2 connector that plugs directly into the
planar. There is an additional fan integrated in each power supply to cool the power supply subsystem
and also provide additional cooling for the whole system. Single processor configurations will have four
fans populated.
The Embedded Server Management logic in the system monitors the speed of the fans. A fan failure
or over-temperature in the system results in a notification by iDRAC6. All system fans are pulse-width
modulated fans. Redundant cooling is supported with one fan failing at a time.
H. Rails and Cable Management
Rack installation components such as rails are provided with the PowerEdge R710 Rack Kit. The rack
installation components are as follows: Sliding rack mount with latest generation Cable Management
Arm (CMA). When the system is installed in a rack, please observe the following guideline:
	

When the system is installed in a rack, only Dell-approved CMAs should be installed behind
the chassis.
Rails
	 • 
Enable the replacement of thumbscrews with slam latches on the chassis for easier stowing in
the rack.
	 • 
Include the new simple and intuitive ReadyRail™ tool-less rack interface for square-hole and
round-hole racks.
	 • 
Provide significantly improved compatibility with non-Dell racks.
	 • 
Static rails for the R610 & R710 fit in all types of four-post and two-post racks available in the
industry including four-post threaded hole racks.
CMAs
	 • 
Provide much larger vent pattern for improved airflow through the CMA.
	 • 
Include a common support tray for eliminating CMA sag.
	 • 
Replaced tie wraps with hook and loop straps to eliminate risk of cable damage during cycling.
	 • 
Maintain key feature of being fully reversible with no conversion required.
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Dell™ PowerEdge™ R710 Technical Guidebook
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J. Control Panel / LCD
The control panel board is connected to the planar via a 60-wire ribbon cable and a separate 5-wire
cable for USB signals only. The LCD plugs into the control panel through a 20-pin ZIF connector and
flex cable.
The system control panel is located on the front of the system chassis to provide user access to
switches, display, and I/O interfaces. Features of the system control panel are:
	 • 
ACPI-compliant power button with an integrated green power LED (controlled by ESM)
	 • 
128x20 pixel LCD with controls
	 	 • 
Two navigation buttons
	 	 • 
One-select button
	 	 • 
One system ID button
	 • 
Non-Maskable-Interrupt (NMI) button (recessed)
	 • 
Ambient temperature sensor
	 • 
Two external USB 2.0 connectors (with two internal connectors dedicated for UIPS)
	 • 
15-pin VGA connector
The LCD panel is a graphics display controlled by the BMC/ESM. Both ESM and BIOS can send error
codes and messages to the display.
The system’s LCD panel provides system information and status messages to signify when the system is
operating correctly or when the system needs attention.
The LCD backlight lights blue during normal operating conditions and lights amber to indicate an error
condition. When the system is in standby mode, the LCD backlight is off and can be turned on by
pressing the Select button on the LCD panel. The LCD backlight will remain off if the “No Message"
option is selected through the iDRAC6, the LCD panel, or other tools.
BIOS has the ability to enter a “Secure Mode" through Setup, which locks the power and NMI buttons.
When in this mode, pressing either button has no effect but does not mask other sources of NMI and
power control.
K. Security
I. Cover Latch
A tooled entry latch is provided on the top of the unit to secure the top cover to the chassis
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Dell™ PowerEdge™ R710 Technical Guidebook
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II. Bezel
A metal bezel is mounted to the chassis front to provide the Dell ID. A lock on the bezel is used to
protect un-authorized access to system peripherals and the control panel. System status via the LCD is
viewable even when the bezel is installed.
III. Hard Drive
The optional front bezel of the system contains a lock. A locked bezel secures the system hard drives.
IV. TPM
The TPM is used to generate/store keys, protect/authenticate passwords, and create/store digital
certificates. TPM can also be used to enable the BitLocker™ hard drive encryption feature in Windows
Server®
2008. TPM is enabled through a BIOS option and uses HMAC-SHA1-160 for binding. There will be
different planar PWA part numbers to accommodate the different TPM solutions. The “Rest of World"
(ROW) version will have the TPM soldered onto the planar. The other version of the planar (post RTS
and primarily for use by China) will have a connector for a plug-in module.
V. Power Off Security
The control panel is designed such that the power switch cannot be accidentally activated. The lock on
the bezel secures the switch behind the bezel. In addition, there is a setting in the CMOS setup that
disables the power button function.
VI. Intrusion Alert
A switch mounted on the left riser board is used to detect chassis intrusion. When the cover is opened,
the switch circuit closes to indicate intrusion to ESM. When enabled, the software can provide
notification to the customer that the cover has been opened.
VII. Secure Mode
BIOS has the ability to enter a secure boot mode via Setup. This mode includes the option to lock out
the power and NMI switches on the Control Panel or set up a system password. See the 11th generation
of PowerEdge servers BIOS Specification for details
L. USB Key
The port on the control panel is for an optional USB key and is located inside the chassis. Some of the
possible applications of the USB key are:
	 • 
User custom boot and pre-boot OS for ease of deployment or diskless environments
	 • 
USB license keys for software applications like eToken™ or Sentinel Hardware Keys
	 • 
Storage of custom logs or scratch pad for portable user defined information (not hot-swappable)
M. Battery
A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the
Real-Time Clock and CMOS RAM on the ICH9 chip.
N. Field Replaceable Units (FRU)
The planar contains a serial EEPROM to contain FRU information including Dell part number, part
revision level, and serial number. The Advanced Management Enablement Adapter (AMEA) also
contains a FRU EEPROM. The backplane’s SEP and the power supplies’ microcontroller are also used to
store FRU data.
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Dell™ PowerEdge™ R710 Technical Guidebook
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Section 3. Electrical
A. Volatility
See Appendix A of this Technical Guidebook
B. ePPID (Electronic Piece Part Identification)
ePPID is an electronic repository for information from the PPID label that is stored in non-volatile RAM.
The BIOS reports the ePPID information using SMBIOS data structures. ePPID includes the following
information:
	 • 
Dell part number
	 • 
Part revision level
	 • 
Country of origin
	 • 
Supplier ID code
	 • 
Date code (date of manufacture)
	 • 
Unique sequence number
COMPOnent description
storage
location
BOARDS
Planar PWA,PLN,SV,DELL,R710 iDRAC FRU
2.5" x 8' Backplane PWA,BKPLN,SV,R710,2.5SASX8 SEP
3.5" x 6' Backplane PWA,BKPLN,SV,R710,3.5SASX6 SEP
3.5" x 4' Backplane PWA,BKPLN,SV,R710,3.5SASX4 SEP
iDRAC Enterprise PWA,RSR, SV, DELL,AMEA FRU
Power supplies
870W PowerEdge™ PSU
PWR SPLY,885W,RDNT,ASTEC PSU Microcontroller
PWR SPLY,885W,RDNT,DELTA PSU Microcontroller
570W Energy Smart PSU
PWR SPLY,598W,RDNT,ASTEC PSU Microcontroller
PWR SPLY,598W,RDNT,COLDWATT PSU Microcontroller
storage cards
PERC 6/i Integrated ASSY,CRD,PERC6I-INT,SAS,NOSLED FRU
PERC 6/E External PWA,CTL,PCIE,SAS,PERC6/E,ADPT FRU
SAS 6/iR Integrated PWA,CTL,SAS,SAS6/IR,INTG FRU
Note: The fans do not have any integrated NVRAM. The PPID tables are currently scanned into a database by the system integrator.
Table: ePPID Support list
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Dell™ PowerEdge™ R710 Technical Guidebook
14
Section 4. Power, Thermal, Acoustic
A. Power Efficiencies
One of the main features of the 11th generation of PowerEdge servers is enhanced power efficiency.
PowerEdge R710 achieves higher power efficiency by implementing the following features:
	 • 
User-selectable power cap (subsystems will throttle to maintain the specified power cap)
	 • 
Improved power budgeting
	 • 
Accurate inlet temperature
	 • 
PSU / VR efficiency improvements
	 • 
Switching regulators instead of linear regulators
	 • 
Closed loop thermal throttling
	 • 
Increased rear venting / 3D venting
	 • 
PWM fans with an increased number of fan zones and configuration-dependent fan speeds
	 • 
Use of DDR3 memory (lower voltage compared to DDR2, UDIMM support)
	 • 
CPU VR dynamic phase shedding
	 • 
Memory VR static phase shedding
	 • 
Random time interval for system start
	 • 
Allows an entire rack to power on without exceeding the available power
	 • 
BIOS Power/Performance options page
	 • 
Active Power Controller (BIOS-based CPU P-state manager)
	 • 
Ability to power down or throttle memory
	 • 
Ability to disable a CPU core
	 • 
Ability to turn off LOMs or PCIe lanes when not being used
	 • 
Option to run PCIe at Gen1 speeds instead of Gen2
B. Power Supplies
I. Main Power Supply
The base redundant system consists of two hot-plug 570W Energy Smart (energy efficient) power
supplies in a 1+1 configuration. An 870W high-output power supply is also available. The power supplies
connect directly to the planar.
There is a power cable to connect between the planar and the backplane. PowerEdge R710 power
supplies have embedded cooling fans.
Starting with the 11th generation of PowerEdge servers (R710, R610, T610, M610, and M710), the
power supplies no longer have a FRU EEPROM. FRU data is now stored in the memory of the PSU
Microcontroller. Additionally, the PSU Firmware can now be updated by the BMC over the PMBus.
Power is “soft-switched,” allowing power cycling via a switch on the front of the system enclosure, or
via software control (through server management functions). In a single power supply configuration,
the power supply is installed in the PS1 location and a blank module (metal cover) is installed in the
PS2 location for factory consistency. Electrically, the system can operate with a single power supply in
either bay.
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Dell™ PowerEdge™ R710 Technical Guidebook
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C. Power Supply Specifications
AC Power supply (per power supply)
Wattage
870 Watt (High Output)
570 Watt (Energy Smart)
Voltage 90-264 VAC, autoranging, 47-63Hz
Heat Dissipation
2968.6 BTU/hr maximum (High Output)
1944.9 BTU/hr maximum (Energy Smart)
Maximum Inrush Current
Under typical line conditions and over the entire system ambient
operating range, the inrush current may reach 55A per power supply
for 10ms or less.
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Dell™ PowerEdge™ R710 Technical Guidebook
16
D. Environmental Specifications
temperature
Operating
10° to 35°C (50° to 95°F) with a maximum temperature gradation of
10°C per hour. Note: For altitudes above 2950 feet, the maximum
operating temperature is derated 1°F/550 ft.
Storage
-40° to 65°C (-40° to 149°F) with a maximum temperature gradation of
20°C per hour
Relative humidity
Operating
20% to 80% (noncondensing) with a maximum humidity gradation of
10% per hour
Storage
5% to 95% (noncondensing) with a maximum humidity gradation of
10% per hour
Maximum vibration
Operating 0.26 Grms at 5-350Hz in operational orientations
Storage 1.54 Grms at 10-250Hz in all orientations
Maximum shock
Operating
Half sine shock in all operational orientations of 31G +/- 5% with a pulse
duration of 2.6 ms +/-10%
Storage
Half sine shock on all six sides of 71G +/- 5% with a pulse duration of
2 ms +/-10%: Square wave shock on all six sides of 27G with velocity
change @ 235 in/sec or greater
Altitude
Operating
-16 to 3048 m (-50 to 10,000 ft) Note: For altitudes above 2950 feet, the
maximum operating temperature is derated 1°F/550 ft.
Storage -16 to 10,600 m (-50 to 35,000 ft)
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Dell™ PowerEdge™ R710 Technical Guidebook
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1
Does not include the power supply handle or ejection tab
F. Maximum Input Amps
Max input current (High Output): 12A @ 90 VAC, 6A @ 180 VAC
Max input current (EnergySmart): 7.8A @ 90 VAC, 3.9A @ 180 VAC
G. Energy SMART Enablement
The 11th generation of PowerEdge servers implements aspects of Dell’s new Energy Smart strategy.
Major differences include:
	 • 
Discontinuing Energy Smart-branded servers with limited configurations and instead offering
Energy Smart components on a portfolio level, such as high capacity and Energy Smart
power supplies
	 • 
Allowing customers to order either a lowest power footprint configuration or a best
performance-per-watt configuration
	 • 
Offering Energy Smart selected components such as DIMMs or hard drives, but not “cherry
picking" or screening individual manufacturers’ components based on energy consumption.
E. Power Consumption Testing
Feature Energy Smart PSU High Output PSU
Dimensions L-206.4 mm1
x W-67.5 mm x H-76.5 mm
Status Indicators 1 x bi-color Light Emitting Diode
Integrated Fans 1 x 60 mm
Fixed Input Plug IEC-C14
AC Cord Rating 15 Amps @ 120 VAC, 10 Amps @ 240 VAC
Input Voltage 90 – 264 VAC
Auto-ranging Yes
Line Frequency 47 – 63Hz
Maximum Inrush Current 55 Amps per supply for 10 ms or less
Hot-Swap Capability Yes
Output Power 570W 870W
Maximum Heat Dissipation 1944.9 BTU per hour 2968.6 BTU per hour
Efficiency (20% - 100% Load)
86.9 – 90.5% @ 115 VAC
88 – 92% @ 230 VAC
85 – 88% @ 115 VAC
87 – 90% @ 230 VAC
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Dell™ PowerEdge™ R710 Technical Guidebook
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H. Acoustics
The acoustical design of the PowerEdge R710 reflects the following:
	 • 
Adherence to Dell’s high sound quality standards. Sound quality is different from sound power
level and sound pressure level in that it describes how humans respond to annoyances in sound,
like whistles, hums, etc. One of the sound quality metrics in the Dell specification is prominence
ratio of a tone, and this is listed in the table below.
	 • 
Office environment acoustics. Compare the values for LpA in the table below and note that
they are lower than ambient noise levels of typical office environments.
	 • 
Hardware configurations affect system noise levels. Dell’s advanced thermal control provides
for optimized cooling with varying hardware configurations. Most typical configurations will
perform as listed in the table below. However some less typical configurations and components
can result in higher noise levels. For example, a system configured with a PERC6/E card will be
approximately twice as loud (~9 dBA higher) in 23+/-2° C ambient.
	 • 
Noise ramp and descent at Bootup. Fan speeds hence noise levels ramp during the boot
process in order to add a layer of protection for component cooling in the case that the system
were not to boot properly.
PowerEdge R710 (2.5" and 3.5" chassis) with RK385 fans (quantity below), 2x 870-W FU096 Power
Supplies, 2.40 GHz Quad-Core E5530 CPUs (quantity below), 7x 2-GB DIMMs, 1x DVD Drive, Perc 6i
card, and 4x Hard Disk Drives (type below)
Acoustical dependence on quantities of fans, CPUs, and Hard Disk Drive type is not strong. The values
below represent therefore the performance for redundant (5x fans and 2x CPUs) as well as the
nonredundant (4x fans and 1x CPU) configurations. They also represent performance for 2.5" 10k SAS
XK112 as well as 3.5" 7.2k SATA NW340 Hard Disk Drives.
Condition in 23 +
_ 2° C ambient LwA-UL, bels LpA, dBA Tones
Standby 3.1 18 No prominent tones
Idle 5.5 39 No prominent tones
Active Hard Disk Drives 5.5 39 No prominent tones
Stressed Processor 5.5 39 No prominent tones
Definitions
Standby: AC Power is connected to Power Supply Units but system is not turned on.
Idle: Reference ISO7779 (1999) definition 3.1.7; system is running in its OS but no other specific activity.
Active Hard Drives: An operating mode per ISO7779 (1999) definition 3.1.6; Section C.9 of ECMA-74
	 9th ed. (2005) is followed in exercising the hard disk drives.
Stressed Processor: An operating mode per ISO7779 (1999) definition 3.1.6; SPECPower set to 50%
	 loading is used.
LwA-UL: The upper limit sound power level (LwA) calculated per section 4.4.2 of ISO 9296 (1988) and
	 measured in accordance with ISO7779 (1999).
LpA: The average bystander position A-weighted sound pressure level calculated per section 4.3 of
	 ISO9296 (1988) and measured in accordance with ISO7779 (1999). The system is placed in a
	 rack with its bottom at 25-cm from the floor.
Tones: Criteria of D.5 and D.8 of ECMA-74 9th ed. (2005) are followed to determine if discrete tones are
	 prominent. The system is placed in a rack with its bottom at 75-cm from the floor. The acoustic
	 transducer is at front bystander position, ref ISO7779 (1999), Section 8.6.2.
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Section 5. Block Diagram
Figure: PowerEdge R710 Main Components
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Dell™ PowerEdge™ R710 Technical Guidebook
20
1. Embedded Network Interface Ports (4)
2. PCIe Gen2 Riser / Slots
3. Broadcom 5709c Network Interface Chip
4. PCIe Gen2 Riser / Slots
5. iDRAC6 Enterprise (Optional)
6. iDRAC6 Express / Lifecycle Controller
7. Heat Sink / Processor Socket
8. DIMM Slots
9. Hot plug, redundant fans
10. Hard drive bay, 6" x 3.5"
11. 
Internal SD Module
(Embedded Hypervisor Optional)
1 5
6
8
9
10
11
7
8
2 3 4
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B. Features
Key features of the 5500 series  2S processor (Nehalem EP) include:
	 • 
Four or two cores per processor
	 • 
Two point-to-point QuickPath Interconnect links at up to 6.4 GT/s
	 • 
1366-pin FC-LGA package
	 • 
45 nm process technology
	 • 
No termination required for non-populated CPUs (must populate CPU socket 1 first)
	 • 
Integrated three-channel DDR3 memory controller at up to 1333MHz
	 • 
Compatible with existing x86 code base
	 • 
MMX™ support
	 	 • 
Execute Disable Bit Intel Wide Dynamic Execution
	 • 
Executes up to four instructions per clock cycle
	 • 
Simultaneous Multi-Threading (Hyper-Threading) capability
	 • 
Support for CPU Turbo Mode (on certain SKUs)
	 	 • 
Increases CPU frequency if operating below thermal, power, and current limits
	 • 
Streaming SIMD (Single Instruction, Multiple Data) Extensions 2, 3, and 4
	 • 
Intel 64 Tecnology for Virtualization
	 • 
Intel VT-x and VT-d Technology for Virtualization
	 • 
Demand-based switching for active CPU power management as well as support for ACPI
P-States, C-States, and T-States
model speed power cache cores
X5570 2.93GHz 95W 8M 4
X5560 2.80GHz 95W 8M 4
X5550 2.66GHz 95W 8M 4
E5540 2.53GHz 80W 8M 4
C. Supported Processors
Section 6. Processors
A. Overview / Description
The Intel 5500 series 2S processor (Nehalem - Efficient Processor (EP)), is the microprocessor designed
specifically for servers and workstation applications. The processor features quad-core processing to
maximize performance and performance/watt for data center infrastructures and highly dense
deployments. The Nehalem-EP 2S processor also features Intel’s Core™ micro-architecture and Intel
64 architecture for flexibility in 64-bit and 32-bit applications and operating systems.
The 5500 series 2S processor (Nehalem EP) utilizes a 1366-contact Flip-Chip Land Grid Array (FC-LGA)
package that plugs into a surface mount socket. PowerEdge R710 provides support for up to two 5500
series  2S processors (Nehalem EP).
Nehalem-EP 2S Processor Features
Cache Size 32KB instruction, 32KB data, 4 or 8MB (shared)
Multi-processor Support 1-2 CPUs
Package LGA1366
Table: Nehalem-EP Features
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Dell™ PowerEdge™ R710 Technical Guidebook
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model speed power cache cores
E5530 2.40GHz 80W 8M 4
E5520 2.26GHz 80W 8M 4
L5520 2.26GHz 60W 8M 4
E5506 2.13GHz 80W 4M 4
L5506 2.13GHz 60W 4M 4
E5504 2.00GHz 80W 4M 4
E5502 1.86GHz 80W 4M 2
model speed power cache cores
X5570 2.93GHz 95W 8M 4
X5560 2.80GHz 95W 8M 4
X5550 2.66GHz 95W 8M 4
E5540 2.53GHz 80W 8M 4
E5530 2.40GHz 80W 8M 4
E5520 2.26GHz 80W 8M 4
L5520 2.26GHz 60W 8M 4
E5506 2.13GHz 80W 4M 4
L5506 2.13GHz 60W 4M 4
E5504 2.00GHz 80W 4M 4
E5502 1.86GHz 80W 4M 2
D. Processor Configurations
Single CPU Configuration
The PowerEdge R710 is designed such that a single processor placed in the CPU1 socket will function
normally, however PowerEdge R710 systems require a CPU blank in the CPU2 socket for thermal reasons.
The system will be held in reset if a single processor is placed in the CPU2 socket.
Performance Enhancements
Intel Xeon®
5500 Series Processor (Nehalem-EP)
Intel®
Turbo Boost
Technology
Increases performance by increasing processor
frequency and enabling faster speeds when
conditions allow
Higher performance
on demand
All cores
operate
at rated
frequency
Normal
Core
1
Core
1
Core
2
Core
3
All cores
operate
at higher
frequency
4C Turbo
Core
0
Core
1
Core
2
Core
3
Fewer cores
may operate
at even higher
frequencies
<4C Turbo
Core
0
Core
1
Frequency
Intel®
Hyper-Threading
Technology
Increases performance for threading applications
delivering greater throughput and responsiveness
Higher performance
for threaded workloads
Intel®
Turbo Boost Technology
Improves application responsiveness
Delivers higher processor frequency on demand
Cores / Threads
2
(2 socket/HT on)
Core
0
IDLE
IDLE
IDLE
Core
0
IDLE
IDLE
IDLE
up to 10%
for 2 software
threads
Benefit
up to 6%†
for 16 concurrent
software threads
16
(2 socket/HT on)
BASE Freq
TURBO Freq
2.93 GHz
3.33 GHz
2.93 GHz
3.20 GHz
Core
0
Core
2
Core
1
Core
3
Core
0
Core
2
Core
1
Core
3
OR
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Dell™ PowerEdge™ R710 Technical Guidebook
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Section 7. Memory
A. Overview / Description
The PowerEdge R710 utilizes DDR3 memory providing a high performance, high-speed memory
interface capable of low latency response and high throughput. The PE R710 supports Registered
ECC DDR3 DIMMs (RDIMM) or Unbuffered ECC DDR3 DIMMs (UDIMM).
Key features of the PowerEdge R710 memory system include:
	 • 
Registered (RDIMM) and Unbuffered (UDIMM) ECC DDR3 technology
	 • 
Each channel carries 64 data and eight ECC bits support for up to 96GB of RDIMM memory
(with twelve 8GB RDIMMs)
	 • 
Support for up to 24GB of UDIMM memory (with twelve 2GB UDIMMs)
	 • 
Support for 1066/1333MHz single- and dual-rank DIMMs
	 • 
Support for 1066MHz quad rank DIMMs
	 • Single DIMM configuration only with DIMM in socket A1
	 • 
Support ODT (On Die Termination) Clock gating (CKE) to conserve power when DIMMs
are not accessed
	 	 • 
DIMMs enter a low-power self-refresh mode
	 • 
I2
C access to SPD EEPROM for access to RDIMM thermal sensors
	 • 
Single Bit Error Correction
	 • 
SDDC (Single Device Data Correction – x4 or x8 devices)
	 • 
Support for Closed Loop
	 • 
Thermal Management on RDIMMs and UDIMMs
	 • Multi Bit Error Detection Support for Memory Optimized Mode
	 • 
Support for Advanced ECC mode
	 • 
Support for Memory Mirroring
B. DIMMs Supported
The DDR3 memory interface consists of three channels, with up to two RDIMMs or UDIMMs per
channel for single-/dual-rank and up to two RDIMMs per channel for quad rank. The interface uses 2GB,
4GB, or 8GB RDIMMs. 1GB or 2GB UDIMMs are also supported. The memory mode is dependent on how
the memory is populated in the system:
Three channels per CPU populated identically:
	 • 
Typically, the system will be set to run in Memory Optimized (Independent Channel) mode in
this configuration. This mode offers the most DIMM population flexibility and system memory
capacity, but offers the least number of RAS (reliability, availability, service) features.
	 • 
All three channels must be populated identically.
	 • 
Users wanting memory sparing must also populate the DIMMs in this method, but one channel
is the spare and is not accessible as system memory until it is brought online to replace a failing
channel.
	 • 
The first two channels per CPU populated identically with the third channel unused
	 	 • 
Typically, two channels operate in Advanced ECC (Lockstep) mode with each other by
having the cache line split across both channels. This mode provides improved RAS
features (SDDC support for x8-based memory).
	 	 • 
For Memory Mirroring, two channels operate as mirrors of each other — writes go to
both channels and reads alternate between the two channels.
CPU Power Voltage Regulation Modules (EVRD 11.1)
Voltage regulation to the 5500 series  2S processor (Nehalem EP) is provided by EVRD (Enterprise
Voltage Regulator-Down). EVRDs are embedded on the planar. CPU core voltage is not shared between
processors. EVRDs support static phase shedding and power management via the PMBus.
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Dell™ PowerEdge™ R710 Technical Guidebook
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	 • 
One channel per CPU populated:
	 	 • 
This is a simple Memory Optimized mode. Mirroring is not supported.
The PowerEdge R710 memory interface supports memory demand and patrol scrubbing, single-bit
correction and multi-bit error detection. Correction of a x4 or x8 device failure is also possible with
SDDC in the Advanced ECC mode. Additionally, correction of a x4 device failure is possible in the Memory
Optimized mode. If DIMMs of different speeds are mixed, all channels will operate at the fastest common
frequency. RDIMMs and UDIMMs cannot be mixed.
	 • 
If memory mirroring is enabled, identical DIMMs must be installed in the same slots across both
channels.
	 • 
The third channel of each processor is unavailable for memory mirroring.
	 • 
The first DIMM slot in each channel is color-coded with white ejection tabs for ease of
installation.
	 • 
The DIMM sockets are placed 450 mils (11.43 mm) apart, center-to-center in order to provide
enough space for sufficient airflow to cool stacked DIMMs.
	 • 
The PE R710 memory system supports up to 18 DIMMs. DIMMs must be installed in each channel
starting with the DIMM farthest from the processor. Population order will be identified by the
silkscreen designator and the System Information Label (SIL) located on the chassis cover.
	 	 • 
Memory Optimized: {1, 2, 3}, {4, 5, 6}, {7, 8, 9}
	 	 • 
Advanced ECC or Mirrored: {2, 3}, {5, 6}, {8, 9}
	 	 • 
Quad Rank or UDIMM: {1, 2, 3}, {4, 5, 6}, {7, 8, 9}
C. Speed
Memory Speed Limitations
The memory frequency is determined by a variety of inputs:
	 • 
Speed of the DIMMs
	 • 
Speed supported by the CPU
	 • 
Configuration of the DIMMs
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Dell™ PowerEdge™ R710 Technical Guidebook
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The table below shows the memory populations and the maximum frequency achievable for that
configuration.
dimm type DImm 0 dimm 1 dimm 2 # of dimms 800 1066 1333
UDIMM
SR 1
DR 1
SR SR 2
SR DR 2
DR DR 2
RDIMM
SR 1
DR 1
QR 1
SR SR 2
SR DR 2
DR DR 2
QR SR 2
QR DR 2
QR QR 2
SR SR SR 3
SR SR DR 3
SR DR DR 3
DR DR DR 3
Note: For QR mixed with an SR/DR DIMM, the QR needs to be in the white DIMM connector. There is no requirement in the order of SR and DR DIMMs.
NOTE: For Quad Rank DIMMs mixed with Single- or Dual-Rank DIMMs, the QR DIMM needs to be in the slot with the white ejection tabs (the first DIMM slot in each channel).
There is no requirement for the order of SR and DR DIMMs
Supported
Not Supported
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Dell™ PowerEdge™ R710 Technical Guidebook
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CPUs
NHM-EP Platform Memory Overview
• 
Platform capability (18 DIMMs):
– Up to 3 channels per CPU
– Up to 3 DIMMS per channel
• 
Memory Types Supported:
– DDR 1333, 1066, and 800
– Registered (RDIMM) and unbuffered (UDIMM)
– Single-rank (SR), dual-rank (DR), quad-rank (QR)
• 
System memory Speed (i.e. the speed at which the memory is
actually running) is set by BIOS depending on:
– CPU capability
– DIMM type(s) used (memory speed, U/RDIMM, SR/DR/QR)
– DIMM populated per channel
• 
All channels in a system will run at the fastest common frequency
1
2
3
NHM-EP NHM-EP
Up to 3
channels
per CPU
Up to 3
DIMMs per
Channel
1 2 3
Memory Population Scenarios
• 
Maximum B/W:
– DDR3 1333 across 3 channels
– 1 DPC (6 DIMMs)
– Max capacity: 48 GB+ CPU
10.6 GB/s
10.6
10.6
CPU
E5550
and above
• 
Balanced Performance:
– DDR3 1066 across 3 channels
– 
Up to 2 DIMMs per Channel
(DPC) (12 DIMMs)
– Max capacity: 96 GB+
CPU
8.5 GB/s
8.5
8.5
CPU
E5520
and above
• 
Maximum capacity:
– DDR3 800 across 3 channels
– Up to 3 DPC (18 DIMMs total)
– Max capacity: 144 GB+ CPU
6.4 GB/s
6.4
6.4
CPU
All
NHM-EP
SKUs
• 
RAS capabilities:
CPU
Mirroring
Channel
0 & 1
mirror
each other
Channel
2 unused
CPU
Lockstep
Channel
0 & 1
operate in
lockstep
Channel
2 unused
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Dell™ PowerEdge™ R710 Technical Guidebook
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E. Supported Configurations
memory
mode
RDIMM
Memory
Module
Size
memory sockets single processor dual processor
1 2 3 physical
memory
(GB)
available
memory
(GB)
physical
memory
(GB)
available
memory
(GB)
4 5 6
OPTIMIZER
2GB
x 2
All
4
All
x x 4 8
x x x x 6 12
x x 4 8
x x x x 8 16
x x x x x x 12 24
4GB
x 4
All
8
All
x x 8 16
x x x x 12 24
x x 8 16
x x x x 16 32
x x x x x x 24 48
8GBa
x 8
All
16
All
x x 16 32
x x x x 24 48
x x 16 32
x x x x 32 64
x x x x x x 48 96
Advanced
ECC
b
or
mirroring
2GB None
x x 4 2 8 4
x x x x 8 4 16 8
4GB None
x x 8 4 16 8
x x x x 16 8 32 16
8GB None
x x 16 8 32 16
x x x x 32 16 64 32
Table: RDIMM Memory Configurations (Each Processor)
D. Slots / Risers
The PowerEdge R710 has 18 DIMM slots for memory. It does not have any riser cards for DIMM population.
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Dell™ PowerEdge™ R710 Technical Guidebook
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memory
mode
RDIMM
Memory
Module
Size
memory sockets single processor dual processor
1 2 3 physical
memory
(GB)
available
memory
(GB)
physical
memory
(GB)
available
memory
(GB)
4 5 6
Mirroring
1GB
None x x 2 1 4 2
x x x x 4 2 8 4
2GB
None x x 4 2 8 4
x x x x 8 4 16 8
a
When available
b
Requires x4- or x8-based memory modules
Table: UDIMM Memory Configurations (Each Processor)
memory
mode
UDIMM
memory
module
size
memory
sockets
single
processor
dual processor
1 2 3 physical
memory
(GB)
available
memory
(GB)
physical
memory
(GB)
available
memory
(GB)
4 5 6
OPTIMIZER
1GB
x 1
All
2
All
x x 2 4
x x x 3 6
x x x x 4 8
x x x x x x 6 12
2GB
x 2
All
4
All
x x 4 8
x x x 6 12
x x x x 8 16
x x x x x x 12 24
Advanced
ECC
a
1GB
None x x 2
All All All
x x x x 4
2GB
None x x 4
All All All
x x x x 8
F. Mirroring
The system supports memory mirroring if identical memory modules are installed in the two channels
closest to the processor (memory is not installed in the farthest channel). Mirroring must be enabled in
the System Setup program. In a mirrored configuration, the total available system memory is one-half of
the total installed physical memory.
G. Advanced ECC (Lockstep) Modes
In this configuration, the two channels closest to the processor are combined to form one 128-bit channel.
This mode supports Single Device Data Correction (SDDC) for both x4- and x8-based memory modules.
Memory modules must be identical in size, speed, and technology in corresponding slots.
H. Optimizer (Independent Channel) Mode
In this mode, all three channels are populated with identical memory modules. This mode permits a larger
total memory capacity but does not support SDDC with x8-based memory modules. A minimal single-
channel configuration of 1GB memory modules per processor is also supported in this mode.
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Section 8. Chipset
A. Overview / Description
The PowerEdge R710 planar incorporated the Intel 5520 chipset (code named Tylersburg) for I/O and
processor interfacing. Tylersburg is designed to support Intel's 5500 series processors (code named
Nehalem-EP), QPI interconnect, DDR3 memory technology, and PCI Express Generation 2. The
Tylersburg chipset consists of the Tylersburg-36D IOH and ICH9.
The Intel 5520 chipset (code named Tylersburg) I/O Hub (IOH)
The planar uses the The Intel®
5520 chipset (code named Tylersburg) I/O Hub (IOH)-36D IOH to provide
a link between the 5500 series 2S processor (Nehalem EP) and I/O components. The main components
of the IOH consist of two full-width QuickPath Interconnect links (one to each processor), 36 lanes of
PCI Express Gen2, a x4 Direct Media Interface (DMI), and an integrated IOxAPIC.
IOH QuickPath Interconnect (QPI)
The QuickPath Architecture consists of serial point-to-point interconnects for the processors and the
IOH. The PowerEdge R710 has a total of three QuickPath Interconnect (QPI) links: one link connecting
the processors and links connecting both processors with the IOH. Each link consists of 20 lanes
(full-width) in each direction with a link speed of up to 6.4 GT/s. An additional lane is reserved for a
forwarded clock. Data is sent over the QPI links as packets.
The QuickPath Architecture implemented in the IOH and CPUs features four layers. The Physical layer
consists of the actual connection between components. It supports Polarity Inversion and Lane Reversal
for optimizing component placement and routing. The Link layer is responsible for flow control and the
reliable transmission of data. The Routing layer is responsible for the routing of QPI data packets. Finally,
the Protocol layer is responsible for high-level protocol communications, including the implementation of
a MESIF (Modify, Exclusive, Shared, Invalid, Forward) cache coherence protocol.
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Intel Direct Media Interface (DMI)
The DMI (previously called the Enterprise Southbridge Interface) connects the Tylersburg IOH with the
Intel I/O Controller Hub (ICH). The DMI is equivalent to a x4 PCIe Gen1 link with a transfer rate of 1 Gb/s
in each direction.
PCI Express Generation 2
PCI Express is a serial point-to-point interconnect for I/O devices. PCIe Gen2 doubles the signaling bit
rate of each lane from 2.5 Gb/s to 5 Gb/s. Each of the PCIe Gen2 ports are backwards-compatible with
Gen1 transfer rates.
In the Tylersburg-36D IOH, there are two x2 PCIe Gen2 ports (1Gb/s) and eight x4 PCIe Gen2 ports (2
Gb/s). The x2 ports can be combined as a x4 link; however, this x4 link cannot be combined with any of
the other x4 ports. Two neighboring x4 ports can be combined as a x8 link, and both resulting x8 links
can combine to form a x16 link.
Intel I/O Controller Hub 9 (ICH9)
ICH9 is a highly integrated I/O controller, supporting the following functions:
	 • 
Six x1 PCIe Gen1 ports, with the capability of combining ports 1-4 as a x4 link
	 	 • 
These ports are unused on the PowerEdge R710
	 • 
PCI Bus 32-bit Interface Rev 2.3 running at 33MHz
	 • 
Up to six Serial ATA (SATA) ports with transfer rates up to 300 MB/s
	 	 • 
The PowerEdge R710 features two SATA port for optional internal optical drive or tape backup
	 • 
Six UHCI and two EHCI (High-Speed 2.0) USB host controllers, with up to twelve USB ports
	 	 • 
The PowerEdge R710 has eight external USB ports and two internal ports dedicated for UIPS.
Refer to the 11th generation of PowerEdge servers Hardware/BIOS Specification for the USB
assignments for each platform
	 • 
Power management interface (ACPI 3.0b compliant)
	 • 
Platform Environmental Control Interface (PECI)
	 • 
Intel Dynamic Power Mode Manager
	 • 
I/O interrupt controller
	 • 
SMBus 2.0 controller
	 • 
Low Pin Count (LPC) interface to Super I/O, Trusted Platform Module (TPM), and SuperVU
	 • 
Serial Peripheral Interface (SPI) support for up to two devices
	 	 • 
The PowerEdge R710’s BIOS is connected to the ICH using SPI
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B. Supported ACPI States
Advanced Configuration and Power Interface – A standard interface for enabling the operating system
to direct configuration and power management.
The Nehalem processor supports the following C-States: C0, C1, C1E, C3, and C6. R710 will support all of
the available C-States.
The PowerEdge R710 will support the available P-States as supported by the specific Nehalem processors:
proc
number
qdF # frequency
standard
tdp
lfm tdp p-state notes
1.60 Pmin+0
1.73 Pmin+1
E5502 Q1G8 1.86 80 75 Pmin+2 D-0
E5504 Q1GM 2.00 80 75 Pmin+3 D-0
L5506 Q1HG 2.13 60 52 Pmin+4 D-0
E5506 Q1GL 2.13 80 75 Pmin+4 D-0
L5520 Q1GN 2.26 60 52 Pmin+5 D-0
E5520 Q1GR 2.26 80 75 Pmin+5 D-0
E5530 Q1GK 2.40 80 75 Pmin+6 D-0
Section 9. BIOS
A. Overview / Description
The PowerEdge R710 BIOS is based on the Dell BIOS core, and supports the following features:
	 • 
Nehalem-EP 2S Support
	 • 
Simultaneous Multi-Threading (SMT) support
	 • 
CPU Turbo Mode support
	 • 
PCI 2.3 compliant
	 • 
Plug n’ Play 1.0a compliant
	 • 
MP (Multiprocessor) 1.4 compliant
	 • 
Boot from hard drive, optical drive, iSCSI drive, USB key, and SD card
	 • 
ACPI support
	 • 
Direct Media Interface (DMI) support
	 • 
PXE and WOL support for on-board NICs
	 • 
Memory mirroring and spare bank support
	 • 
SETUP access through <F2> key at end of POST
	 • 
USB 2.0 (USB boot code is 1.1 compliant)
	 • 
F1/F2 error logging in CMOS
	 • 
Virtual KVM, CD, and floppy support
	 • 
Unified Server Configurator (UEFI 2.1) support
	 • 
Power management support including DBS, power inventory and multiple power profiles
The PowerEdge R710 BIOS does not support the following:
	 • 
Embedded Diagnostics (embedded in MASER)
	 • 
BIOS language localization
	 • 
BIOS recovery after bad flash (but can be recovered from iDRAC6 Express)
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Dell™ PowerEdge™ R710 Technical Guidebook
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Table: Nehalem P-State Projections
C. I2
C (Inter-Integrated Circuit)
What is I2
C? A simple bi-directional 2-wire bus for efficient inter-integrated circuit control. All I2
C-bus
compatible devices incorporate an on-chip interface which allows them to communicate directly with
each other via the I2
C-bus. This design concept solves the many interfacing problems encountered
when designing digital control circuits. These I2
C devices perform communication functions between
intelligent control devices (e.g., microcontrollers), general-purpose circuits (e.g., LCD drivers, remote
I/O ports, memories), and application-oriented circuits.
The PowerEdge R710, BIOS accesses the I2
C through the ICH9 (Intel I/O Controller Hub 9). There are two
MUXes on ICH9’s I2
C bus.
	 • 
One MUX (U_ICH_SPD) controls the DIMM SPDs through four split segments
	 • 
The other MUX (U_ICH_MAIN) controls the clock buffers, TOE, USB Hub through four split
segments.
BIOS controls both the MUXes through the two select lines using GPIO pins.
Clock chip, USB hub, and the front panel EEPROM device addresses are located on the IOH I2
C bus.
Section 10. Embedded NICs / LAN on Motherboard (LOM)
A. Overview / Description
Embedded Gigabit Ethernet Controllers with TCP Offload Engine (TOE) support
Two embedded Broadcom 5709C dual-port LAN controllers are on the R710 planar as independent
Gigabit Ethernet interface devices. The following information details the features of the LAN devices.
	 • 
x4 PCI Express Gen2 capable interface
	 	 • 
The PowerEdge R710 operates this controller at Gen1 speed
	 • 
Integrated MAC and PHY 3072x18 Byte context memory
	 • 
64 KB receive buffer
	 • 
TOE (TCP Offload Engine)
	 • 
iSCSI controller (enabled through an optional hardware key)
	 • 
RDMA controller (RNIC) (enabled post-RTS through an optional hardware key)
	 • 
NC-SI (Network Controller-Sideband Interface) connection for manageability
	 • 
Wake-On-LAN (WOL)
	 • 
PXE 2.0 remote boot
	 • 
iSCSI boot
	 • 
IPv4 and IPv6 support
	 • 
Bare metal deployment support
proc
number
qdF # frequency
standard
tdp
lfm tdp p-state notes
E5540 Q1G2 2.53 80 75 Pmin+7 D-0
X5550 Q1GJ 2.67 95 75 Pmin+8 D-0
X5560 Q1GF 2.80 95 75 Pmin+9 D-0
X5570 Q1G9 2.93 95 75 Pmin+10 D-0
W5580 Q1G6 3.20 130 98 Pmin+12 D-0
Page: 32
Dell™ PowerEdge™ R710 Technical Guidebook
33
Section 11. I/O Slots
A. Overview / Description
The PowerEdge R710 requires two PCI Express risers: Riser 1 and Riser 2. Each riser connects to the
planar through an x16 PCI Express connector.
	 • 
Riser 1 consists of two x4 slots and a third x4 slot dedicated for internal SAS storage through
the PERC 6i or SAS 6/iR.
	 • 
The default Riser 2 consists of two x8 PCI Express connectors.
	 • 
There is also an optional x16 Riser 2 that supports one x16 PCI Express card.
To ensure proper cooling, no more than two of the four expansion cards can have a power consumption
of greater than 15W (up to 25W maximum each), not including the integrated storage controller.
The system does not support hot-plug or hot-removal of PCI Express cards.
The table below provides a guide for installing expansion cards to ensure proper cooling and mechanical
fit. The expansion cards with the highest priority should be installed first using the slot priority indicated.
All other expansion cards should be installed in card priority and slot priority order.
card
priority
card type
slot
priority
Max
allowed
25W
Card?
1 PERC 5/E controller 1, 3, 4 2 Y
2 PERC 6/E 3, 4, 1 2 Y
3 10Gb NIC 3, 4, 1, 2 2 Y
4 All other Dell storage cards 3, 4, 1 2 Y
5 All other NICs 2, 1 4a
Nb
6 Non-Dell storage cards 1, 2 4a
Nb
a
Maximum of 2 of any card whose maximum power exceeds 15w
b
Refer to the expansion card’s documentation to determine if the maximum power exceeds 15w
Page: 33
Dell™ PowerEdge™ R710 Technical Guidebook
34
Dell™ PowerEdge™ R710 Technical Guidebook
Poweredge R710
PCI Express Gen2 Slots
Slot 1: Half-Length (6.6" Factory Installation) / Full-Height (x8 connector), x4 link width
Slot 2: Full-Length (12.2" Factory Installation) / Full-Height (x8 connector), x8 link width
Slot 3: Full-Length (12.2" Factory Installation) / Full-Height (x8 connector), x8 link width
Slot 4: Half-Length (6.6" Factory Installation) / Full-Height (x8 connector), x4 link width
Slot 5: Half-Length (6.6" Factory Installation) / Full-Height (x8 connector), x4 link width
Category
Card
Priority
Description Dell PN
PCIe Link
Width
Slot
Priority
Max
Cards
Internal Storage
(Integrated Slot)
1 Dell™ PERC 6/i Integrated (Sled)
T95
4J
Gen1 x8 Integrated 1
Internal Storage
(Integrated Slot)
2 Dell SAS 6/iR Integrated (Sled)
YK8
38
Gen1 x8 Integrated 1
External Storage
Controller
3
*Dell PERC 5/E Adapter
(Test only, no factory install)
GP2
97
Gen1 x8 Slot 4, 51
22
External Storage
Controller
4
*Dell PERC 6/E Adapter
(512MB)
J15 5F Gen1 x8
Slot 3, 2,
5, 4, 1
22
External Storage
Controller
5
*Dell PERC 6/E Adapter
(256MB)
F98
9F
Gen1 x8
Slot 3, 2,
5, 4, 1
22
10Gb NIC 6
*Intel 10GBase-T Copper Single
Port NIC (Copperpond)
XR9
97
Gen1 x8
Slot 4, 5, 1,
2, 3
2
10Gb NIC 7
*Broadcom BCM57710
10GBase-T Copper Single Port
NIC (Quiver)
RK3
75
Gen1 x8
Slot 4, 5, 1,
2, 3
2
10Gb NIC 8
Intel®
10GBase-SR Optical
Single Port NIC (BelleFontaine)
RN
219
Gen1 x8
Slot 4, 5, 1,
2, 3
2
External Storage
Controller
9 *Dell SAS 5/E Adapter
M7
78G
Gen1 x8
Slot 3, 2,
4, 5, 1
22
Internal Tape
Controller
10
Dell SAS 5/iR Adapter
(for internal tape only)
UN
939
Gen1 x8
Slot 3, 2,
4, 5, 1
22
Fibre Channel
8 HBA
11
Emulex LPe12002 FC8
Dual-Channel HBA
C85
6M
Gen2 x4
Slot 4, 5, 1,
2, 3
5
Fibre Channel
8 HBA
12
Emulex LPe12000 FC8
Single-Channel HBA
C85
5M
Gen2 x4
Slot 4, 5, 1,
2, 3
5
1
Thermal testing to determine if the PERC5 can be installed in other slots is pending.
2
A maximum of 2 nternal/external storage controllers (Dell PERC and SAS cards) are allowed in the system in addition to the integrated storage controller.
Page: 34
Dell™ PowerEdge™ R710 Technical Guidebook
35
B. PCI Express Risers
The two PowerEdge R710 PCI Express risers provide up to four expansion slots and one internal slot
as follows:
	 • 
Two x8 and two x4 PCI Express Gen2 slots, connected to the IOH
	 • 
One x4 PCI Express Gen1 slot for internal storage, connected to the IOH
	 • 
Support for three full-height 9.5" long PCI Express cards and one full-height bracket, low-profile
PCB PCI Express card
	 • 
Support for field upgrading one slot (on the center riser) to a full-length 12.2" PCI Express card
	 • 
System supports 25W maximum power for the first two cards and 15W for the third and
fourth cards
	 	 • 
The lower power support on the third and fourth cards is due to system thermal limitations
	 • 
An optional x16 riser to accommodate interface cards for external GPU boxes that supports a
maximum power of 25W. Use of this riser reduces the number of PCI Express slots from four
to three
C. Additional Riser Restrictions
	 • 
The riser connectors on the planar do not support plugging in a standard PCI Express card. Do
not attempt this for troubleshooting.
	 • 
Two PowerEdge R710 risers must be installed or the system will not power up.
D. X16 Express Card Specifications
The PowerEdge R710 supports x16 cards that meet the following requirements:
	 • 
Standard height (4.376")
	 • 
Maximum length of 9.5" (Half-length cards are 6.6"; Full-length cards are 12.283")
	 • 
x16 cards can only plug into the optional PowerEdge R710 x16 left riser
	 • 
Support for full bandwidth of x16 Gen2 link
	 • 
No support for hot-plug or hot-removal
	 • 
Maximum power of 25W
	 • 
The PowerEdge R710 provides +12V, +3.3V, and +3.3Vaux in accordance with Power Supply Rail
Requirements (Table 4-1 of PCIe Card Electromechanical Spec, Rev 2.0)
	 • 
The PowerEdge R710 x16 slot is not compliant with the PCI Express x16 Graphics
150W-ATX Specification
	 • 
x16 cards must be compliant with the PCI Express Card Electromechanical Specification Rev 2.0
	 • 
x16 cards must only occupy the space of one slot. Cards that occupy the space of two slots are
not supported
	 • 
The x16 card is limited to 25W initial start-up power until it is configured as a high-power
device. If no value is set for the Slot Power Limit, the card is limited to 25W. The card must then
either scale down to 25W or disable operation per PCI Express Base Spec Rev 2.0
	 • 
The x16 card must be able to support a maximum operating temperature of 55°C as defined in
the Dell PCI Environmental Spec and the PCI Express Card Electromechanical Spec. The
PowerEdge R710 provides a minimum transverse air velocity of 100 LFM (linear feet per minute)
to the x16 card.
E. Boot Order
PCIe scan order (from the BIOS HW spec v1.0)
IOH port 1,2 (PCI Express Gen1 x4) – Broadcom BCM5709C Gigabit Embedded NIC #1
IOH port 3 (PCI Express Gen1 x4) – Broadcom BCM5709C Gigabit Embedded NIC #2
IOH port 4 in Bluefish or ICH9 port1-4 in Thidwick (PCI Express Gen1 x4) – Integrated PERC6i or SAS6i 	
	 on the Riser 1
IOH port 5 (PCI Express Gen2 x4) – Slot 2 on Riser 1
IOH port 6 (PCI Express Gen2 x4) – Slot 1 on Riser 1
IOH port 7/8 (PCI Express Gen2 x8) – Slot 3 on Riser 2
IOH port 9/10 (PCI Express Gen2 x8) – Slot 4 on Riser 2
For PCI-e X16 optional left riser, IOH port 7,8,9,10 are combined into one x16 PCI-e slot.
Page: 35
Dell™ PowerEdge™ R710 Technical Guidebook
36
Section 12. Storage
A. Overview / Description
The PowerEdge R710 supports three different backplanes to support different hard drive configurations:
six 3.5" hard drives, four 3.5" hard drives, or eight 2.5" hard drives.
On each backplane are two LED indicators per drive slot with one or two mini-SAS x4 cable connectors
for connecting the backplane to the integrated SAS 6/iR or PERC 6i, and a power connector to connect
to the planar. Both Serial Attached SCSI (SAS) and Serial ATA (SATA) hard drives are supported. For
SAS/SATA mixing, two SAS drives are supported with the 3.5" backplane.
B. Drives
I. Internal Hard Disk drives
The PowerEdge R710 supports up to eight 2.5" or six 3.5" hard disk drives.
	 • 
Support for 15,000 rpm 3.5" SAS drives
	 • 
Support for 10,000 and 15,000 rpm 2.5" SAS drives
	 • 
Support for 7,200 rpm 3.5" Near Line SAS drives
	 • 
Support for 7,200 rpm 3.5" and 2.5" Enterprise SATA drives
	 • 
Support for 7,200 rpm 3.5" and 2.5" SATAu drives
	 • 
For SAS/SATA mixing, two SAS and up to six SATA drives are possible
	 	 • 
A pair of SAS drives must be installed in slots 0 and 1
	 • 
One mixed 2.5" and 3.5" hard drive configuration is allowed:
	 	 • 
A pair of 2.5" 10k rpm SAS drives must be installed with an adapter in a 3.5" hard drive
carrier in drive slots 0 and 1
	 	 • 
The remaining hard drives must be 3.5" hard drives and must be either all SAS or all
SATA
	 • 
Support for 25 and 50GB 2.5" solid state drives at RTS (additional solid state drive support is
Post RTS)
	 • 
SSDs require the PERC 6/i Integrated storage controller and cannot be mixed with any other
type of hard drive
2.5 HDDs
2.5" Enterprise SATA 7.2K HDs 160GB, 250GB, and 500GB
2.5" SAS 10K HDs: 73GB, 146GB, and 300GB
2.5" entry 10K SAS in 3.5" HDD carrier
2.5" SAS 15K HDs 73GB and 146GB
2.5" Enterprise SATA SSD 25GB, 50GB, and 100GB
2.5" SSD 25GB and 50GB
3.5 HDDs
Support for 3.5" Enterprise SATA 7.2K:
160GB, 250GB, 500GB, 750GB, and
1,000GB
Support for 3.5" Enterprise SATAu 7.2K:
500GB SATAu, 750GB SATAu, and
1 ,000GB SATAu
Support for 3.5" Green Enterprise SATA 5.4K 1,000GB
Support for 3.5" Near Line SAS 7.2K 500GB, 750GB, and 1,000GB
Support for 3.5" SAS 15K HDs: 146GB, 300GB, and 450GB
Table: R710 supported HDD matrix
Page: 36
Dell™ PowerEdge™ R710 Technical Guidebook
37
For mixed SAS/SATA configurations, SAS drives must be installed as a pair in drive slots 0 and 1.
One mixed 2.5" and 3.5" hard drive configuration is allowed: a pair of 2.5" 10k rpm SAS drives can be
installed with an adapter in a 3.5" hard drive carrier in drive slots 0 and 1. The remaining hard drives must
be 3.5" hard drives and must be either all SAS or all SATA.
PowerEdge
R710
Platforms 4
All 2.5" HDD SAS (or) SATA 4
All 2.5" SSD*** 4
Mixed SSD/SAS** 4
All 3.5" HDD SAT (or) SATA 4
Mixed SAS/SATA* 4
2.5" SAS in 3.5" HDD Carrier (RTS+) 4
2.5" SAS HDD in 3.5" HDD Carrier + 3.5" SATA HDDs (Mixed SAS) 4
2.5" SAS HDD in 3.5" HDD Carrier + 3.5" SATA HDDs (Mixed SAS/SATA)* 4
	 • 
SAS HDDs should be in slots 0 & 1 and min/max number of SAS HDDs is 2, rest will be SATA
HDDs and min/max number of SATA HDDs depends on the configuration.
	 • 
**No maximum for SAS HDD’s combined with SSD
	 • 
***SSD Support requires PERC 6/i
20GB and 50GB solid state drives (SSD) support will be supported at RTS
II. Hard Disk Drive Carriers
Hard drives must use the Dell 2.5" and the 3.5" Hard Drive Disk Carriers.
Figure: 2.5" HDD Carrier
III. Empty Drive Bays
For the slots that are not occupied by drives, a carrier blank is provided to maintain proper cooling,
maintain a uniform appearance to the unit, and provide EMI shielding.
Page: 37
Dell™ PowerEdge™ R710 Technical Guidebook
38
config
type
configs description
non-mixed
drives, all
sata or
all sas
Mixed SAS/ SATA
Min 2xSAS+1xSATA
2.5": Max 2xSAS + 6xSATA
3.5": Max 2xSAS + 6xSATA
Min
HDD
Max
HDD
Min
HDD
MAX
HDD
SAS/SATA
(No RAID)
0 MSS
Integrated
SAS/SATA No RAID
(SAS 6/iR)
2.5"=1
3.5"=1
2.5"=8
3.5"=8
SAS/SATA
(RAID)
1 MSSR0
Integrated
SAS/SATA RAID 0
(SAS 6/iR, PERC6/I)
2.5"=1*
3.5"=1*
2.5"=8
3.5"=8
N/A
2 MSSR1
Integrated
SAS/SATA RAID 1
(SAS 6/iR, PERC6/I)
2.5"=2
3.5"=2
2.5"=2
3.5"=2
N/A
3 MSSR5
Integrated
SAS/SATA RAID 5
(PERC 6/i)
2.5"=3
3.5"=3
2.5"=8
3.5"=8
N/A
4 MSSR6
Integrated
SAS/SATA RAID 6
(PERC 6/i)
2.5"=4
3.5"=4
2.5"=8
3.5"=8
N/A
5 MSSR10
Integrated
SAS/SATA RAID 10
(PERC 6/i)
2.5"=4
3.5"=4
2.5"=8
3.5"=8
6 MSSR1R1
Integrated
SAS/SATA RAID
1/RAID 1
(SAS 6/iR, PERC 6/i)
2.5"=2+2
3.5"=2+2
2.5"=2+2
3.5"=2+2
7 MSSR1R5
Integrated
SAS/SATA RAID
1/RAID 5 (PERC 6/i)
2.5"=2+3
3.5"=2+3
2.5"=2+6
3.5"=2+6
SAS/SATA
(No RAID)
8 MSS-X
Integrated
SAS/SATA No RAID
(SAS 6/iR)
2.5"=3
3.5"=3
2.5"=6
3.5"=6
IV. Diskless Configuration Support
The system supports diskless configuration with no storage controller (SAS 6/iR or PERC 6i) installed in
the system. A 2.5" HDD backplane is still installed in this configuration.
V. Hard Drive LED Indicators
Each disk drive carrier has two LED indicators visible from the front of the system. One is a green LED
for disk activity and the other is a bicolor (green/amber) LED for status information. The activity LED is
driven by the disk drive during normal operation. The bicolor LED is controlled by the SEP device on the
backplane. Both LEDs are used to indicate certain conditions under direction of a storage controller.
C. RAID Configurations
PowerEdge R710 Factory Configuration Summary
Page: 38
Dell™ PowerEdge™ R710 Technical Guidebook
39
config
type
configs description
non-mixed
drives, all SSD
Mixed SSD/ SAs
Min 2xSSD+1xSAS
2.5": Max 2xSSD + 6xSAS
Min
HDD
Max
HDD
Min
HDD
MAX
HDD
SSD
(RAID)
11 MSSR1
Integrated SSD
RAID 1 (PERC 6/i)
2.5"=2
3.5"=N/A
2.5"=2
3.5"=N/A
N/A
12 MSSR5
Integrated SSD
RAID 5 (PERC 6/i)
2.5"=3
3.5"=N/A
2.5"=
3.5"=N/A
N/A
13 MSSR10
Integrated SSD
RAID 10 (PERC 6/i)
2.5"=4
3.5"=N/A
2.5"=8
3.5"=N/A
N/A
SSD/SAS
(RAID)
14 MSSR1R5-X
Integrated
SSD/SAS RAID
1/RAID 5
(PERC 6/i)
2.5"=2+3
3.5"=N/A
2.5"=2+6
3.5"=N/A
config
type
configs description
non-mixed
drives, all
sata or
all sas
Mixed SAS/ SATA
Min 2xSAS+1xSATA
2.5": Max 2xSAS + 6xSATA
3.5": Max 2xSAS + 6xSATA
Min
HDD
Max
HDD
Min
HDD
MAX
HDD
SAS/SATA
(RAID)
9 MSSR1R1- X
Integrated
SAS/SATA RAID
1/RAID 1
(SAS 6/iR, PERC 6/i)
2.5"=2+2
3.5"=2+2
2.5"=2+2
3.5"=2+2
10 MSSR1R5-X
Integrated
SAS/SATA RAID
1/RAID 5
(PERC 6/i)
2.5"=2+3
3.5"=2+3
2.5"=2+6
3.5"=2+6
* Minimum of 1 hard drive for PERC6i ; and minimum of 2 for SAS6iR.
D. Storage Controllers
I. SAS 6/iR
The PowerEdge R710 internal SAS 6/iR HBA is an expansion card that plugs into a dedicated PCI
Express x8 slot (only four lanes wired). It incorporates two four-channel SAS IOCs for connection to
SAS/SATA hard disk drives. It is designed in a form factor that allows the same card to be used in R610
and T610.
Page: 39
Dell™ PowerEdge™ R710 Technical Guidebook
40
product Usage
R710
Support
Slot
PCIe
CON
PCIe
bracket
I/O
CON
RAID BBU
PERC
SAS/SATA
PERC 6/i
Integrated
Internal
Backplane
Storage
(HDD, SSD)
Yes, Max 1
Storage
slot
x8 No
x4 int
x4 int
0, 1,
5, 6,
10, 50,
and
60
Yes
PERC 6/E
Adapter
External
SAS/SATA
Storage
Yes, Max 2
(MD1000
Pompano
& MD1020
Ridgeback)
PCIe
slot
x8 Yes
x4 ext
x4 ext
0, 1,
5, 6,
10, 50,
and
60
TBBU
PERC 5/E
Adapter
External
Legacy
Storage
Yes, Max 2
(MD1000,
Pompano,
& MD1020
Ridgeback)
PCIe
slot
x8 Yes
x4 ext
x4 ext
0, 1, 5,
10, 50
TBBU
SAS
HBA
SAS/SATA
SAS 6/iR
Integrated
Internal
Backplane
Storage
(No tape
or SSD
support)
Yes, Max 1
Storage
slot
x8 No
x4 int
x4 int
0, 1 No
SAS 5/E
Adapter
External
SAS (DAS,
Tape)
Yes, Max 2
PCIe
slot
x8 Yes
x4 ext
x4 ext
none No
ICH9
On Planar
via chipset
Internal
slim-line
SATA
Optical
and/or
TBU Only
(no HDD)
Yes, 2
ports for
Optical
and/or
TBU
n/a n/a n/a x1 int n/a n/a
LSI
2032
SCSI
LSI 2032
Adapter
Internal or
External
SCSI
Tape/
Legacy
External
storage
Yes, Max 2
PCIe
slot
x8 Yes
SCSI
int
SCSI
ext
n/a n/a
Note: A maximum of 2 external storage controllers (Dell PERC or SAS cards) are allowed in the system in
addition to the integrated storage controller.
II. PERC 6i
For customers who want a hardware RAID solution, the PERC 6i is an option. The PERC 6i uses the LSI
1078 ROC (RAID on Chip) processor with a PCI Express host interface and DDR2 memory. A battery is
also available for backup.
Page: 40
Dell™ PowerEdge™ R710 Technical Guidebook
41
E. LED Indicators
Each disk drive carrier has two LED indicators visible from the front of the system. One is a green LED
for disk activity and the other is a bicolor (green/amber) LED for status information. The activity LED is
driven by the disk drive during normal operation. The bicolor LED is controlled by the SEP device on the
backplane. Both LEDs are used to indicate certain conditions under direction of a storage controller.
F. Optical Drives
Optical drives are optional in all of the PowerEdge R710 systems and connect to the planar via the SATA
interface. The following internal slim-line drives are available on the PowerEdge R710: DVD-ROM and
DVD+RW. PATA (IDE) optical drives are not supported.
If an optical drive is not ordered with the system, a blank is installed in its place.
G. Tape Drives
Internal tape drives are optional in systems with the 4x3.5" or 8x2.5" backplanes. Internal SATA tape
drives connect directly to the SATA connector on the planar. Internal SCSI tape drives connect through
the LSI 2032 PCI Express SCSI adapter card.
TAPE DRIVES
Internal Tape
Internal (RD1000 Half-Height SATA)
DAT72 Half –Height SCSI
Internal Tape
Drive Bays
One 3.5" Half-Height Tape Drive Bay
External TBU
External (RD1000 USB)
LTO-2L (Legacy, SCSI)
LTO-3-060 (SCSI)
LTO-3 (Legacy, SCSI)
LTO-4-120 (Half-Height SAS)
LTO-4-120 (Full-Height SAS)
2U external TBU (PV114T)
DAT72 Half–Height SCSI
External
TBU/Automation
4U SAS, SCSI, iSCSI, and FC
2U SAS, SCSI, iSCSI, and FC
ML6000 Family SAS, SCSI, and FC
2U external TBU (PV124T ) Legacy SCSI
Page: 41
Dell™ PowerEdge™ R710 Technical Guidebook
42
resolution refresh rate (Hz) Color Depth (bit)
640 x 480 60, 72, 75, and 85 8, 16, and 32
800 x 600 56, 60, 72, 75, and 85 8, 16, and 32
1024 x 768 60, 72, 75, and 85 8, 16, and 32
1152 x 864 75 8, 16, and 32
1280 1024 60, 75, and 85 8 and 16
1280 1024 60 32
chassis config tape backup unit (internal)
Backplane Type Config TBU Controller TBU Cable
3.5" x 6" No TBU N/A N/A
3.5" x 4"
No TBU N/A N/A
Internal for 3.5 Bay (RD 1000 Half-Height
SATA)
Connects to MB XR724
DAT72 for 3.5 Bay (Half-Height SCSI) LSI 2032 (SCSI) HBA DR017
No TBU N/A N/A
Internal for 3.5 Bay (RD 1000
Half-Height SATA)
Connects to MB RN694
2.5" x 8 DAT72 for 3.5 Bay (Half-Height SCSI) LSI 2032 (SCSI) HBA CJ176
Section 13. Video
A. Overview / Description
The PowerEdge R710 Integrated Dell Remote Access Controller 6 (iDRAC6) incorporates an integrated
video subsystem, connected to the 32-bit PCI interface of the ICH9. This logic is based on the Matrox
G200. The device only supports 2D graphics. The video device outputs are multiplexed between the
front and rear video ports. If a monitor is connected to the front video connector, it will take precedence
over the rear connection, thereby removing the display from the rear connection. The integrated video
core shares its video memory with the iDRAC6’s 128MB DDR2 application space memory. This memory
is also used for the KVM buffer.
The PowerEdge R710 system supports the following 2D graphics video modes:
Page: 42
Dell™ PowerEdge™ R710 Technical Guidebook
43
Section 14. Audio
A. Overview / Description
No speakers supported
Section 15. Rack Information
A. Overview / Description
Rack installation components such as rails are provided with the PowerEdge R710 Rack Kit. The rack
installation components are as follows: Sliding Rack mount with latest generation Cable Management
Arm (CMA). When the system is installed in a rack, please observe the following guidelines:
Nothing should be located within 12" of the front of the unit that would restrict the airflow into the system.
Nothing should be mounted or placed behind the chassis that would restrict airflow from exiting the
system. Only Dell approved CMAs can be placed behind the chassis. All other objects should be located
at least 24" away from the rear of the chassis.
When two systems are placed back to back, the separation between the units should be at least 24" if
the exit airflow is equivalent for the two chassis. This allows the exit air to escape without creating an
extreme back pressure at the rear of one of the chassis.
B. Cable Management Arm (CMA)
Notes: 	• 
CMA supports for the maximum number of cables supported by system
	 • 
The numbers in this matrix represent the number and types of external cables required to be
supported by the CMA solution.
	 • 
This matrix is built on the practical worst case configuration in each platform based on prior
and projected take rates. Note that other combinations of adapters and associated cables exist,
but are assumed to fall within these guidelines from the standpoint of bend radius and
flexibility, cable bundling, cable volume, etc.
	 • 
PCI NIC cables are assumed to be Ethernet.
	 • 
KVM cable dongle may be used for mouse/keyboard/video.
Cable Type Number of cables
Mouse – USB 1
Keyboard – USB 1
Video – VGA 1
Power Cords 2
LOMs – Ethernet 1
PCI NICs 1
Total 8
Page: 43
Dell™ PowerEdge™ R710 Technical Guidebook
44
C. Rails
Support for Dell 4210 & 2410 racks
Support for Dell 4200 & 2400 racks without CMA
Support for HP/Compaq 10XXX series racks
Support for HP/Compaq 9XXX & 7XXX series racks without CMA
Support for tool-less installation in CEA-310-E compliant square hole 4-post racks including:
Support for Dell 2410 24U Rack
Support for Dell 4210 Rack
Support for HP/Compaq 10xxx series
Support for tooled or tool-less installation in CEA-310-E compliant round hole 4-post racks
(tool-less preferred)
Support for flush and center mount installation in CEA-310-E compliant 2-post racks (1U & 2U only)
The R710 rail supports the following racks:
Page: 44
Dell™ PowerEdge™ R710 Technical Guidebook
45
Section 16. Operating Systems
A. Overview / Description
The PowerEdge R710 supports Windows®
, Linux®
, and Solaris™ Operating Systems.
Windows®
Support:
x86
or
x64
INSTALLATION
Factory
INSTALLATION
logo
certification
schedule
Test/
Validate
support
Windows®
Small Business Server 2008 and Essential Business Server 2008
x64
Standard/
Premium
Yes
Windows
Hardware
Quality Labs -
Windows 2008
Shipping Yes Yes
Windows Server®
2008 (x64 includes Hyper-V™)
x64
Standard
Yes
Windows
Hardware
Quality Labs -
Windows 2008
Shipping Yes Yes
Enterprise
Datacenter
Windows Server® 2008
x86
Standard
Yes
Windows
Hardware
Quality Labs -
Windows 2008
Shipping Yes Yes
Enterprise
Windows®
Web Server 2008
x86
and
x64
Web Yes
Windows
Hardware
Quality Labs -
Windows 2008
Shipping Yes Yes
Windows Server®
2008, SP2 (x64 includes Hyper-V™)
x64
Standard
Yes
Windows
Hardware
Quality Labs -
Windows 2008
Available in
August -
October
2009
Yes Yes
Enterprise
Datacenter
Windows Server®
2008, SP2
x86
Standard
Yes
Windows
Hardware
Quality Labs -
Windows 2008
Available in
August -
October
2009
Yes Yes
Enterprise
Windows®
Web Server 2008, SP2
x86
and
x64
Web Yes
Windows
Hardware
Quality Labs -
Windows 2008
Available in
August -
October
2009
Yes Yes
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Dell™ PowerEdge™ R710 Technical Guidebook
46
Red Hat®
Enterprise Linux 4.7
x86
and
x64
ES/AS
Available in
June 2009
n/A
Available in
June 2009
Yes Yes
Red Hat Enterprise Linux 5.2
x86
and
x64
Standard/AP Yes n/A Shipping Yes Yes
Red Hat Enterprise Linux 5.3
x86
and
x64
Standard/AP
Available in
June 2009
n/A
Available in
June 2009
Yes Yes
Novell®
SUSE®
Linux Enterprise Server 10 SP2
x64 Enterprise Yes n/A Shipping Yes Yes
Novell SUSE Linux Enterprise Server 11
x64 Enterprise
Available in
June 2009
n/A
Available in
June 2009
Yes Yes
Solaris™ 10 05/09
x64 Enterprise Drop in the box n/A
Available in
June 2009
Yes Yes
Linux support:
Windows Server®
2008, R2, (x64 includes Hyper-V™)
x64
Standard
Yes
Windows
Hardware
Quality Labs -
Windows 2008
Release 2
Available in
November
2009 -
January
2010
Yes Yes
Enterprise
Datacenter
x86
or
x64
INSTALLATION
Factory
INSTALLATION
logo
certification
schedule
Test/
Validate
support
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Dell™ PowerEdge™ R710 Technical Guidebook
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Section 17. Virtualization
A. Overview / Description
Supported embedded hypervisors:
	 • Microsoft®
Windows Server®
2008 Hyper-V
	 • VMware®
ESXi Version 4.0 and 3.5 update 4
	 • Citrix®
XenServer 5.0 with Hotfix 1 or later
Section 18. Systems Management
A. Overview / Description
Dell is focused on delivering open, flexible, and integrated solutions the help our customers reduce the
complexity of managing disparate IT assets. We build comprehensive IT management solutions.
Combining Dell PowerEdge Servers with a wide selection of Dell-developed management solutions, we
provide customers choice and flexibility – so you can simplify and save in environments of any size.
To help you meet your server performance demands, Dell offers Dell OpenManage™ systems
management solutions for:
	 • Deployment of one or many servers from a single console
	 • Monitoring of server and storage health and maintenance
	 • Update of system, operating system, and application software
We offer IT management solutions for organizations of all sizes – priced right, sized right, and
supported right.
B. Server Management
A Dell Systems Management and Documentation DVD and a Dell Management Console DVD are included
with the product. ISO images are also available. The following sections briefly describe the content.
Dell Systems Build and Update Utility: Dell Systems Build and Update Utility assists in OS install and
pre-OS hardware configuration and updates.
OpenManage Server Administrator: The OpenManage Server Administrator (OMSA) tool provides a
comprehensive, one-to-one systems management solution, designed for system administrators to
manage systems locally and remotely on a network. OMSA allows system administrators to focus on
managing their entire network by providing comprehensive one-to-one systems management.
Management Console: Our legacy IT Assistant console is also included, as well as tools to allow access
to our remote management products. These tools include: Remote Access Service, for iDRAC, and the
BMC Management Utility.
Active Directory Snap-in Utility: The Active Directory Snap-in Utility provides an extension snap-in to
the Microsoft Active Directory. This allows you to manage Dell specific Active Directory objects. The
Dell-specific schema class definitions and their installation are also included on the DVD.
Dell Systems Service Diagnostics Tools: Dell Systems Service and Diagnostics tools deliver the latest
Dell optimized drivers, utilities, and operating system-based diagnostics that you can use to update
your system.
eDocs: The section includes Acrobat files for PowerEdge systems, storage peripheral and
OpenManage software.
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Dell™ PowerEdge™ R710 Technical Guidebook
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Dell Management Console DVD: The Dell Management Console is a Web-based systems management
software that enables you to discover and inventory devices on your network. It also provides advanced
functions, such as health and performance monitoring of networked devices and patch management
capabilities for Dell systems.
Server Update Utility: In addition to the Systems Management Tools and Documentation and Dell
Management Console DVDs, customers have the option to obtain Server Update Utility DVD. This
DVD has an inventory tool for managing updates to firmware, BIOS and drivers for either Linux or
Windows varieties.
C. Embedded Server Management
The PowerEdge R710 implements circuitry for the next generation of Embedded Server Management. It
is Intelligent Platform Management Interface (IPMI) v2.0 compliant. The iDRAC6 (Integrated Dell Remote
Access Controller) is responsible for acting as an interface between the host system and its management
software and the periphery devices. These periphery devices consist of the PSUs, the storage backplane,
integrated SAS HBA or PERC 6/i and control panel with semi-intelligent display.
The iDRAC6 provides features for managing the server remotely or in data center lights-out
environments.
Advanced iDRAC features require the installation of the iDRAC6 Enterprise card.
I. Unmanaged Persistent Storage
The unmanaged persistent storage consists of two ports:
	 • one located on the control panel board
	 • one located on the Internal SD Module
The port on the control panel is for an optional USB key and is located inside the chassis. Some of the
possible applications of the USB key are:
	 • User custom boot and pre-boot OS for ease of deployment or diskless environments
	 • USB license keys for software applications like eToken™ or Sentinel Hardware Keys
	 • 
Storage of custom logs or scratch pad for portable user-defined information (not hot-pluggable)
The Internal SD Module is dedicated for an SD Flash Card with embedded Hypervisor for virtualization.
The SD Flash Card contains a bootable OS image for virtualized platforms.
II. Lifecycle Controller/Unified Server Configurator
Embedded management is comprised of several pieces which are very interdependent.
	 • 
Lifecycle Controller
	 • 
Unified Server Configurator
	 • 
iDRAC6
	 • 
vFLASH
Lifecycle controller is the hardware component that powers the embedded management features. It is
integrated and tamperproof storage for system-management tools and enablement utilities (firmware,
drivers, etc.). It is flash partitioned to support multiple, future use cases.
Dell Unified Server Configurator is a 1:1 user interface exposing utilities from Lifecycle Controller. Customers
will use this interface to configure hardware, update server, run diagnostics, or deploy the operating
system. This utility resides on Lifecycle Controller. To access the Unified Server Configurator, press <F10>
key within 10 seconds of the Dell logo display during the system boot process. Current functionality
enabled by the Unified Server Configurator includes:
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Dell™ PowerEdge™ R710 Technical Guidebook
49
feature description
Faster O/S
Installation
Drivers and the installation utility are embedded on system, so no need to
scour DELL.COM
Faster System Updates
Integration with Dell support automatically directed to latest versions
of the Unified Server Configurator iDRAC, RAID, BIOS, NIC, and
Power Supply
Update Rollback
Description: Ability to recover to previous “known good state” for all
updatable components
More Comprehensive
Diagnostics
Diagnostic utilities are embedded on system
Simplified Hardware
Configuration
Detects RAID controller and allows user to configure virtual disk
and choose virtual disk as boot device, eliminating the need to
launch a separate utility and also provides configuration for iDRAC,
BIOS, and NIC/LOM.
III. iDRAC6 Express
The iDRAC6 Express is the first tier of iDRAC6 upgrades. In addition to upgrading the system with a
Lifecycle Controller, the iDRAC6 Express offers the following key features:
	 • 
Graphical web interface
	 • 
Standard-based interfaces
	 • 
Server Sensor monitoring and fault alerting
	 • 
Secure operation of remote access functions including authentication, authorization,
and encryption
	 • 
Power control and management with the ability to limit server power consumption and
remotely control server power states
	 • 
Advanced troubleshooting capabilities
For more information on iDRAC6 Express features see the table below.
IV. iDRAC6 Enterprise
The optional iDRAC6 Enterprise card provides access to advanced iDRAC6 features. The iDRAC6
Enterprise connects directly to the PowerEdge R710 planar and is mounted parallel to the planar
with stand-offs.
Key features for the iDRAC6 Enterprise include:
	 • 
Scripting capability with Dell’s Racadm command-line
	 • 
Remote video, keyboard, and mouse control with Virtual Console
	 • 
Remote media access with Virtual Media
	 • 
Dedicated network interface
Additionally, the iDRAC6 Enterprise can be upgraded by adding the vFlash Media card. This is a 1GB
Dell branded SD card that enabled a persistent 256MB virtual flash partition. In the future, vFlash will be
expanded to include additional features.
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Dell™ PowerEdge™ R710 Technical Guidebook
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A more detailed feature list for iDRAC6 Enterprise and vFlash is included in the table below.
Feature BMC
iDRAC6
Express
iDRAC6
Enterprise
VFlash
Media
Interface and Standards Support
IPMI 2.0 4 4 4 4
Web-based GUI 4 4 4
SNMP 4 4 4
WSMAN 4 4 4
SMASH-CLP 4 4 4
Racadm command-line 4 4
Conductivity
Shared/Failover Network Modes 4 4 4 4
IPv4 4 4 4 4
VLAN tagging 4 4 4 4
IPv6 4 4 4
Dynamic DNS 4 4 4
Dedicated NIC 4 4
Security & Authentication
Role-based Authority 4 4 4 4
Local Users 4 4 4 4
Active Directory 4 4 4
SSL Encryption 4 4 4
Remote Management & Remediation
Remote Firmware Update 4 4 4 4
Server power control 4 4 4 4
Serial-over-LAN (with proxy) 4 4 4 4
Serial-over-LAN (no proxy) 4 4 4
Power capping 4 4 4
Last crash screen capture 4 4 4
Boot capture 4 4 4
Serial-over-LAN 4 4 4
Virtual media 4 4
Virtual console 4 4

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